POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING PATTERN CURED FILM, AND ELECTRONIC COMPONENT

摘要

PROBLEM TO BE SOLVED: To provide a positive photosensitive resin composition which is reduced in exposure time and has high sensitivity.

SOLUTION: The positive photosensitive resin composition contains (a) a polymer having a phenolic hydroxyl group or carboxyl group, (b) an iodonium compound having two or more iodonium structures in one molecule, (c) a diazonaphthoquinone compound, and (d) a solvent.

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