ADHESIVE FILM FOR SEMICONDUCTOR, METHOD OF MANUFACTURING ADHESIVE FILM FOR SEMICONDUCTOR, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide an adhesive film for semiconductor that holds holding properties of individual pieces of semiconductor elements in a dicing process and detachability of the individual pieces of the semiconductor elements in a pick-up process for a long period under little influence of transport and storage conditions etc., of a pressure-sensitive adhesive film.

SOLUTION: The adhesive film for semiconductor includes an adhesive layer 1 and a peeling layer 2 wherein the adhesive layer 1 and peeling layer 2 are joined together, and is used to pick up from the peeling layer an individual piece of a semiconductor element with an adhesive layer which is obtained by sticking a surface of the adhesive layer 1 on the opposite side from the peeling layer 2 on a semiconductor wafer, and cutting and dicing the semiconductor wafer and adhesive layer 1 in the sticking state. The peeling layer 2 contains a radiation-curable resin, and peeling strength between the adhesive layer 1 and peeling layer 2 after 30-day temperature treatment under conditions of 25°C and a relative humidity of 60% is within a range of 0.8 to 1.5 times as large as a value before the temperature treatment.

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