CIRCUIT BOARD LAMINATED MODULE AND ELECTRONIC DEVICE

摘要

PROBLEM TO BE SOLVED: To quickly reduce the influence of electromagnetic noise generated by a circuit without substantially changing the shape of a ground layer in a circuit board laminated module.

SOLUTION: In a plurality of ground layers of a mother board (10) on which a semiconductor chip 30 is mounted through an interposer (20), noise guiding through-vias GH for leading the electromagnetic noise from the semiconductor chip 30 to the underlayer is provided. The noise guiding through-vias GH are provided on a side different from an inductor in a circling direction of a noise source.

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