| 摘要 |
A cooling system for an electronic apparatus, includes: a casing in which the electronic apparatus is housed; an evaporator which is disposed at a rear surface side of the casing, and cools heat released from the electronic apparatus by a refrigerant; a slide mechanism which connects the casing and the evaporator to be movable in a longitudinal direction with respect to the casing; at least any one of a cooling tower which is provided at a higher place than the evaporator and condenses the refrigerant by cooling of external air and sprinkled water, and a heat exchanger which cools the refrigerant by using chilled water; a circulation line which moves the refrigerant between the evaporator and at least one of the cooling tower and the heat exchanger; and a piping which connects the circulation line and the evaporator, and is extendable and contractible in response to movement of the evaporator.
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