| 发明名称 |
PHENOLIC COMPOUND, EPOXY RESIN, EPOXY RESIN COMPOSITION, PREPREG, AND CURED PRODUCT THEREOF |
| 摘要 |
Provided are a phenolic compound and an epoxy resin that have excellent solubility in solvents and that provide cured products exhibiting high thermal conductivity. The disclosed phenolic compound is prepared, for example, by the reaction of a compound represented by formula (1) with a compound represented by formula (6), the formulas being set forth in claim 1. The disclosed epoxy resin is prepared by reacting said phenolic compound with an epihalohydrin. |
| 申请公布号 |
WO2011093474(A1) |
申请公布日期 |
2011.08.04 |
| 申请号 |
WO2011JP51832 |
申请日期 |
2011.01.28 |
| 申请人 |
NIPPONKAYAKU KABUSHIKIKAISHA;KAWAI KOUICHI;OSHIMI KATSUHIKO;SUNAGA TAKAO;INOUE KAZUMA |
发明人 |
KAWAI KOUICHI;OSHIMI KATSUHIKO;SUNAGA TAKAO;INOUE KAZUMA |
| 分类号 |
C08G59/20;C07C49/753;C07C49/84;C08J5/24;C08K3/00;C08L63/00;H01L23/29;H01L23/31 |
主分类号 |
C08G59/20 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
