发明名称 PASTE FOR LAMINATED CERAMIC ELECTRONIC COMPONENT
摘要 <P>PROBLEM TO BE SOLVED: To provide paste for a laminated ceramic electronic component which exhibits excellent drying property and solubility of a binder resin and suppresses the occurrence of sheet attack, and to provide the laminated ceramic electronic component using the paste for the laminated ceramic electronic component. <P>SOLUTION: The paste for a laminated ceramic electronic component is used by being applied on a ceramic green sheet and dried, and contains a polyvinyl acetal resin, an organic solvent and inorganic powder, wherein the organic solvent contains butylene glycol di-acetate. <P>COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011148649(A) 申请公布日期 2011.08.04
申请号 JP20100010326 申请日期 2010.01.20
申请人 SEKISUI CHEM CO LTD 发明人 YAMANAKA ISAO
分类号 C04B35/00;C04B35/632;H01B1/22;H01G4/12 主分类号 C04B35/00
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