| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a processing operation device or an ACF attachment inspection method capable of effectively inspecting various ACF attached conditions or surely inspecting ACF attached conditions and distinguishing a cause of trouble when luminance has changed, in particular trouble of luminance drop such as illumination deterioration has generated, or a display substrate module assembly line with a higher uptime ratio by noticing the cause of trouble and providing maintenance of the cause (preparation, correspondence). <P>SOLUTION: A predetermined position is illuminated and imaged, a determination area is set at a region where the ACF must exist in the image data obtained by the imaging, the image data on a circumference of the determination area is processed, an attached condition of the ACF is inspected based on the processing result or a luminance level of the image data is detected, and the cause of change of the luminance level is distinguished based on the change with time of the luminance level. <P>COPYRIGHT: (C)2011,JPO&INPIT |
