发明名称 GRANULAR MATERIAL FOR LIGHTWEIGHT MOLDING RESIN AND LIGHTWEIGHT MOLDING RESIN COMPOSITION
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a granular material for a molding resin which has particles not easily broken when mixed with a resin component of high viscosity, and can keep a hollow state even if cracked partially, has high heat resistance, and can be used for a molding resin such as engineering plastics and which provides a satisfactory lightweight effect with addition of a smaller amount than conventional ones, and to provide a lightweight molding resin composition of the granular material for a molding resin. <P>SOLUTION: The granular material for the molding resin comprising hollow silica particles to be compounded in the molding resin, has≥5μm average particle diameter and has an inner space composed of a plurality of independent closed cells partitioned with partitioning walls. It is preferable that the granular material has an average particle diameter of 5μm to 20 mm, a residual ratio of floating at 8 MPa hydrostatic pressure of 25% or more and a weight per unit volume of 0.05 to 0.35 g/cm<SP>3</SP>. The lightweight molding resin composition contains the granular material. <P>COPYRIGHT: (C)2011,JPO&INPIT</p>
申请公布号 JP2011149016(A) 申请公布日期 2011.08.04
申请号 JP20100285984 申请日期 2010.12.22
申请人 TAIHEIYO MATERIALS CORP 发明人 NOGUCHI MASAAKI;WACHI HIDEKI
分类号 C08L101/00;C01B33/18;C01B33/26;C04B38/00;C08K7/22 主分类号 C08L101/00
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