| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a cooling apparatus capable of having a heat dissipation structure appropriate for respective electronic devices. <P>SOLUTION: The cooling apparatus 1, configured to cool multiple electronic devices 21, includes a base section 10 that is positioned so as to face the electronic devices 21 and has accommodating chambers 10a, through which a refrigerant can pass and which are disposed at positions corresponding to the respective electronic devices 21. In each accommodating chamber 10a, cooling fins 12 exhibiting heat dissipation capability determined on the basis of the amount of heat generation of electronic device 21 corresponding to the accommodating chamber 10a are housed, thereby allowing a design wherein different cooling fins 12 are used for the respective electronic devices. Thus, even when the electronic devices 21 vary in the amount of heat generated, an appropriate heat dissipation structure can be attained. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
