发明名称 PRINTED WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To form a stable solder shape having a reduced height variation on a land in the surrounding of a screw hole even in flow soldering. SOLUTION: The printed wiring board includes: a screw hole for fixing a screw that also serves as a ground connection of the printed wiring board; and a land in the surrounding of the screw hole to perform soldering around the screw hole. The land in the surrounding of the screw hole has: a screw contact land; a drawing land; and a connection land connecting the screw contact land and the drawing land. By arranging the drawing land behind the flow direction, the drawing land is placed at a location where an icicle-like projection due to flow solder may occur, and thereby no icicle-like projection occurs in the screw connection land. Accordingly, a stable solder shape having a reduced height variation can be compactly formed on the land in the surrounding of the screw hole even in flow soldering. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011151106(A) 申请公布日期 2011.08.04
申请号 JP20100009764 申请日期 2010.01.20
申请人 PANASONIC CORP 发明人 WATANABE MASAKI;KIMURA TOSHIFUMI
分类号 H05K3/34 主分类号 H05K3/34
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