METHOD FOR FORMING PATTERNED CONDUCTIVE FILM

摘要

Disclosed is a method for forming a patterned conductive film, which is characterized by comprising a step wherein a substrate that is provided with a patterned layer composed of platinum microcrystal particles is brought into contact with a complex of an amine compound and aluminum hydride at a temperature of 50-120°C. By this method, a patterned conductive film which can secure an electrical connection with a substrate and is suitable for use in various electronic devices can be formed by a simple procedure without requiring large and heavy equipment.