| 摘要 |
PURPOSE: An electronic component molding apparatus is provided to reduce a size of the electronic component molding apparatus and the time to be required to a molding progress of an electronic component by reducing a substrate transfer distance and using liquefied resin. CONSTITUTION: A first and a second molds(110,120) are arranged in the one way direction and mold electronic components. A loader(130) is arranged in the one side of the first and the second molds and loads and unloads a substrate mounted the electronic components to the first and the second molds. A pick-up unit(140) is arranged in one side of the loader facing the first and the second molds and loads and unloads a substrate to the loader. A rail unit is arranged in one side of the pick-up unit facing the loader and loads and unloads a substrate to the pick-up unit. An in-out stage(160) is arranged to be contiguous to one end of the rail unit and supports magazines for purchasing numerous substrates. A resin dispenser(170) is arranged another side of the first and the second molds facing the loader and supplies the liquid resin for the molding of the electronic components to the first and the second molds.
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