发明名称 BONDED WAFER AVALANCHE PHOTODIODE AND METHOD FOR MANUFACTURING SAME
摘要 <p>An avalanche photodiode includes a high quality electrooptically active substrate, a handle substrate bonded to the active substrate, and an avalanche photodiode active area formed in the high quality electrooptically active substrate including a high field region for generating avalanche current gain. By using a handle wafer bonded to the active substrate, the avalanche photodiode of the subject invention has a greater strength and thickness without the reduction of desirable electrical characteristics.</p>
申请公布号 EP2013915(A4) 申请公布日期 2011.08.03
申请号 EP20070719577 申请日期 2007.04.18
申请人 PERKINELMER CANADA, INC. 发明人 DAUTET, HENRI;SEYMOUR, RICHARD
分类号 H01L31/107;H01L31/06 主分类号 H01L31/107
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