| 摘要 |
An electronic component that allows efficient separation of a mother substrate into components each functioning as a device and a method for manufacturing the electronic component are provided. On the mother substrate, (a) a conductive layer (10) including electrodes (12a, 12b, 14a, 14b, 16a, and 16b) and pads (12s, 12t, 14s, 14t, 16s, and 16t) for a plurality of devices, (b) an insulating layer that partially covers the conductive layer (10) and that has pad openings surrounding the pads (12s, 12t, 14s, 14t, 16s, and 16t) and exposing at least center portions of the pads, and (c) power supply lines (22 to 28) that connect the pads of neighboring ones of the devices are formed. Power is applied to the power supply lines (22 to 28), and electrolytic plating is performed. Thus, plating layers are formed in the pad openings. Subsequently, external terminals are formed on the plating layers. By cutting the mother substrate, the mother substrate is separated into components each functioning as a device. Divided surfaces of the plurality of power supply lines are formed on each of the components so as to be separated from one another. |
