LOW-PROFILE HEAT-SPREADING LIQUID CHAMBER USING BOILING
摘要
Systems and fabrication methods are disclosed for a heat spreader to cool a device. The heat spreader has first and second opposing proximal surfaces defining a chamber having a liquid therein; and one or more structures mounted in the chamber to induce a liquid flow pattern during a boiling of the liquid to distribute heat.
申请公布号
EP2129987(A4)
申请公布日期
2011.08.03
申请号
EP20080799692
申请日期
2008.03.14
申请人
VAPRO, INC.;BOARD OF REGENTS, THE UNIVERSITY OF TEXAS SYSTEM
发明人
YOU, SEUNG MUN;KIM, JOO HAN;KWARK, SANG M.;KIM, JESSE JAEJIN
