发明名称 |
Electronic component mounting board, method of manufacturing the same, electronic component module, and communications equipment |
摘要 |
A ceramic laminated board is provided which has thermal via holes penetrating the inside from the main face of the board. In the thermal via hole, a heat transfer body is placed which has a metallic body and a composite material provided entirely or partially between the metallic body and the ceramic laminated board. The composite material is higher in thermal conductivity than air and is lower in thermal expansion coefficient than the metallic body. |
申请公布号 |
EP1369917(B1) |
申请公布日期 |
2011.08.03 |
申请号 |
EP20030012908 |
申请日期 |
2003.06.06 |
申请人 |
PANASONIC CORPORATION |
发明人 |
ISHIZAKI, TOSHIO |
分类号 |
H01L23/367;H01L23/66;H05K1/02;H05K1/03;H05K3/40 |
主分类号 |
H01L23/367 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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