| 摘要 |
Disclosed is a vacuum heating/cooling device which is capable of rapidly heating and rapidly cooling a substrate exclusively, whilst preserving a high degree of vacuum subsequent to film-forming processing, and which suppresses increases in temperature over time caused by the retention of heat by the members within the chamber, and reduces temperature variation between substrates. The disclosed vacuum heating/cooling device which heats/cools a substrate in a vacuum is provided with: a vacuum chamber; a radiant energy source which is disposed on the atmosphere side of the vacuum chamber and which radiates heating light; an light entry section through which the heating light from the radiant energy source enters into the vacuum chamber; and a substrate movement mechanism, which is provided with a substrate holding member for holding a substrate, and which moves the substrate held by the substrate holding member to a heating position close to the radiant energy source during heating, and moves the substrate and the substrate holding member to a non-heating position remote from the radiant energy source during non-heating periods. The substrate holding member is plate shaped so that the substrate can be mounted thereon, and has an external form which is larger than the external form of the light entry section through which heating light enters. |
