发明名称 |
PREHEATING APPARATUS FOR METAL CORE PCB SUBSTRATE AND SOLDERING METHOD ON THE SUBSTRATE USING IT |
摘要 |
PURPOSE: A preheating device for a metal core PCB and a method for soldering the metal core PCB using the same are provided to efficiently solder the metal core PCB by preheating the metal core PCB before a soldering process. CONSTITUTION: A metal core(110) is inserted into a PCB. A preheating unit directly preheats the metal core by applying a current to the metal core. An insulation layer is formed on both sides of the metal core. A circuit layer(130) is formed on the outer side of the insulation layer.
|
申请公布号 |
KR20110088196(A) |
申请公布日期 |
2011.08.03 |
申请号 |
KR20100007987 |
申请日期 |
2010.01.28 |
申请人 |
KOREA ELECTRIC TERMINAL CO., LTD. |
发明人 |
LEE, JEONG HEON |
分类号 |
H05K3/34;B23K3/08;H05K1/02 |
主分类号 |
H05K3/34 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|