发明名称 PREHEATING APPARATUS FOR METAL CORE PCB SUBSTRATE AND SOLDERING METHOD ON THE SUBSTRATE USING IT
摘要 PURPOSE: A preheating device for a metal core PCB and a method for soldering the metal core PCB using the same are provided to efficiently solder the metal core PCB by preheating the metal core PCB before a soldering process. CONSTITUTION: A metal core(110) is inserted into a PCB. A preheating unit directly preheats the metal core by applying a current to the metal core. An insulation layer is formed on both sides of the metal core. A circuit layer(130) is formed on the outer side of the insulation layer.
申请公布号 KR20110088196(A) 申请公布日期 2011.08.03
申请号 KR20100007987 申请日期 2010.01.28
申请人 KOREA ELECTRIC TERMINAL CO., LTD. 发明人 LEE, JEONG HEON
分类号 H05K3/34;B23K3/08;H05K1/02 主分类号 H05K3/34
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