发明名称 RESIN COMPOSITION FOR PLATING USE AND RESIN PLATED PRODUCT
摘要 There is provided a resin composition for plating use in which all of plating adhesion strength, moldability, impact resistance, and low coefficient of linear expansion are excellent; and a resin plated product. The resin composition for plating use of the present invention is characterized by including a graft copolymer (A) formed by graft polymerizing a specific monomer component onto a rubber-like polymer (d) constituted of a conjugated diene-based rubber, and a specific copolymer (B), wherein a proportion of the rubber-like polymer (d) is 10 to 20% by mass, relative to the combined total of the graft copolymer (A) and the copolymer (B) which accounts for 100% by mass, and also 1 to 8 parts by mass of an antioxidant (C) having a melting point of 25 to 100°C is added, relative to the combined total of the graft copolymer (A) and the copolymer (B) which accounts for 100 parts by mass.
申请公布号 EP2351791(A1) 申请公布日期 2011.08.03
申请号 EP20090828855 申请日期 2009.11.26
申请人 UMG ABS, LTD. 发明人 SAKAI, HIROSHI;YAMASHITA, SHINJI
分类号 C08L51/04;C08K5/00;C08L25/12;C25D5/56 主分类号 C08L51/04
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