发明名称 |
Light-emitting diode chip package body and packaging method thereof |
摘要 |
AN LED chip package body provides an LED chip with a pad-installed surface, a plurality of pads disposed on the pad-installed surface and a rear surface formed opposite the pad-installed surface. The LED chip package body further has a light-reflecting coating disposed on the pad-installed surface of the LED chip and a plurality of pad-exposed holes for exposure of the corresponding pads of the LED chip. The LED chip package body further comprises a light-transparent element disposed on the rear surface of the LED chip and a plurality of conductive projecting blocks. Each of the conductive projecting blocks is disposed on the corresponding pad of the LED chip.
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申请公布号 |
US7989817(B2) |
申请公布日期 |
2011.08.02 |
申请号 |
US20080007276 |
申请日期 |
2008.01.09 |
申请人 |
SUZHOU INDUSTRIAL PARK TONY LIGHTING TECHNOLOGY CO., LTD. |
发明人 |
SHEN YU-NUNG |
分类号 |
H01L33/00;H01L29/227;H01L33/38;H01L33/54;H01L33/62 |
主分类号 |
H01L33/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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