Redistribution layer enhancement to improve reliability of wafer level packaging,申请号US12616077-传众专利搜索

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发明名称	Redistribution layer enhancement to improve reliability of wafer level packaging
摘要
申请公布号	US7989961(B2)	申请公布日期	2011.08.02
申请号	US12616077	申请日期	2009.11.10
申请人		发明人
分类号	H01L0023/000048;H01L0023/000052;H01L0029/000040	主分类号	H01L0023/000048
代理机构		代理人
主权项
地址

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