发明名称 |
Resin composite copper foil, printed wiring board, and production processes thereof |
摘要 |
A resin composite copper foil comprising a copper foil and a resin layer containing a block copolymer polyimide and a maleimide compound, the resin layer being formed on one surface of the copper foil, a production process thereof, a copper-clad laminate using the resin composite copper foil, a production process of a printed wiring board using the copper-clad laminate, and a printed wiring board obtained by the above process. |
申请公布号 |
US7989081(B2) |
申请公布日期 |
2011.08.02 |
申请号 |
US20070657529 |
申请日期 |
2007.01.25 |
申请人 |
MITSUBISHI GAS CHEMICAL COMPANY, INC.;PI R&D CO., LTD. |
发明人 |
NOZAKI MITSURU;GAKU MORIO;TANAKA YASUO;NAGATA EIJI;KIKUCHI YASUO;YANO MASASHI |
分类号 |
B32B15/08;B32B27/06;C23C18/54 |
主分类号 |
B32B15/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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