发明名称 Multi-layer wiring board
摘要 In a multi-layer wiring board in which board wirings are arranged in a plurality of wiring layers so as to be connected via a through hole, two through holes are provided in parallel, and two through holes are connected therebetween in both end portions of the respective through holes or one end portion thereof by the wiring board.
申请公布号 US7989708(B2) 申请公布日期 2011.08.02
申请号 US20070974335 申请日期 2007.10.12
申请人 HITACHI, LTD. 发明人 TAKADA YOSHIFUMI
分类号 H05K1/02;H05K1/11;H05K3/34;H05K3/42;H05K3/46;H05K7/06 主分类号 H05K1/02
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