发明名称 Electroless gold plating bath, electroless gold plating method and electronic parts
摘要 An electroless gold plating bath includes a water-soluble gold compound, a complexing agent, an aldehyde compound, and an amine compound represented by R1—NH—C2H4—NH—R2 or (CH2—NH—C2H4—NH—CH2)n—R4 (wherein R1 to R4 represent —OH, —CH3, —CH2OH, —C2H4OH, —CH2N(CH3)2, —CH2NH(CH2OH), —CH2NH(C2H4OH), —C2H4NH(CH2OH), —C2H4NH(C2H4OH), —CH2N(CH2OH)2, —CH2N(C2H4OH)2, —C2H4N(CH2OH)2 or —C2H4N(C2H4OH)2, and n is an integer of 1 to 4). The electroless gold plating can be carried out without corrosion of an underlying metal to be plated at a stable deposition rate. Because of the high deposition rate and the immersion and reduction types, thickening of a plated coating is possible in one solution and the color of the coating is not degraded to provide a good appearance while keeping a lemon yellow color inherent to gold.
申请公布号 US7988773(B2) 申请公布日期 2011.08.02
申请号 US20070987881 申请日期 2007.12.05
申请人 C. UYEMURA & CO., LTD. 发明人 KISO MASAYUKI;SAIJO YOSHIKAZU;KAMITAMARI TOHRU
分类号 C23C18/44;B05D1/18 主分类号 C23C18/44
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