| 摘要 |
<p>The invention relates to a method and to a device for sound emission analysis, wherein vibrations occurring during the use of a component, during the testing of a component or during the processing of a work piece by means of chipping, welding, forming, joining and/or separating or the like are registered and evaluated, wherein a vibration spectrum is recorded at different times or continuously and subjected to a multi-dimensional evaluation.</p> |
