| 摘要 |
PROBLEM TO BE SOLVED: To provide a circuit board having a connection structure for achieving connection between a wiring layer and a transparent electrode satisfactorily while suppressing an increase in a manufacturing cost and the number of processes and degradation of yield, a method for manufacturing the same, and an electronic device mounted with a light emitting panel to which the circuit board is applied. SOLUTION: The source electrode Ts (or the wiring layer L2 formed integrally with the source electrode Ts) of a thin film transistor TFT provided on an insulating substrate 11 and a transparent electrode ELP provided on an interlayer insulating film 13 covering the thin film transistor TFT are electrically connected via a conductive layer Lm provided on the substrate 11. Here, the source electrode Ts (or the wiring layer L2) is formed of an aluminum alloy, and the transparent electrode ELP and the conductive layer Lm are formed of a transparent electrode material such as ITO. COPYRIGHT: (C)2011,JPO&INPIT
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