| 发明名称 |
FILM FOR FORMING SEMICONDUCTOR PROTECTION FILM, AND SEMICONDUCTOR DEVICE |
| 摘要 |
<p>Disclosed is a film for forming a semiconductor protection film, which protects a surface, which is on the reverse side of a surface where an outermost semiconductor element is mounted on a structure, such as a substrate. The resin composition configuring the film for forming the semiconductor protection film contains (A) a thermosetting component, and (B) an inorganic filler.</p> |
| 申请公布号 |
WO2011089664(A1) |
申请公布日期 |
2011.07.28 |
| 申请号 |
WO2010JP04932 |
申请日期 |
2010.08.05 |
| 申请人 |
SUMITOMO BAKELITE CO., LTD.;HIRANO, TAKASHI;YOSHIDA, MASATO |
发明人 |
HIRANO, TAKASHI;YOSHIDA, MASATO |
| 分类号 |
H01L23/00;H01L21/301;H01L21/683;H01L23/29;H01L23/31;H01L25/065;H01L25/07;H01L25/18 |
主分类号 |
H01L23/00 |
| 代理机构 |
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代理人 |
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