SUBSTRATE TREATMENT DEVICE AND SUBSTRATE TREATMENT METHOD

摘要

Disclosed is a substrate treatment device which can heat a treatment solution with higher efficiency and can utilize the treatment solution with high efficiency, thereby treating the surface of a plate-like substrate. Specifically disclosed is a substrate treatment device which is equipped with a treatment solution supply mechanism (50) for supplying a treatment solution (S) onto the surface of a plate-like substrate (100) that is held on a rotatable substrate-holding section (10), and which can treat the surface of the plate-like substrate (100) with the treatment solution (S). The device has a treatment solution-holding plate (15) which is so arranged as to face the surface of the plate-like substrate (100) (which is held on the substrate-holding section (10)) with predetermined spacing and is so adapted that the treatment solution is held between a gap between the surface of the plate-like substrate (100) and the treatment solution-holding plate (15), and also has a heating section (20) which is so arranged as to contact with a predetermined region containing a position corresponding to the rotating axis of the substrate-holding section (10) in the treatment solution-holding plate (15) and which can heat the predetermined region. The treatment solution supply mechanism is so adapted that the treatment solution (S) can be supplied to a gap between the surface of the plate-like substrate (100) that can rotate together with the substrate-holding section (10) and the treatment solution-holding plate (15) that can be heated by means of the heating section (20).