| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method and device for manufacturing a leadframe, which is capable of forming dimples on the leadframe with a high density and of suppressing the occurrence of warping deformation of the leadframe due to the formation of dimples. <P>SOLUTION: After first dimples 16 arrayed at intervals of a fixed space Sp in a row direction and a column direction perpendicular to each other are formed on a die pad 12 of the leadframe 1, second dimples 16 arrayed at intervals of the same space Sp as that of the first dimples 16 in the row direction and the column direction are formed to have such a positional relationship that the second dimples 16 are shifted from the first dimples by a distance Sp/2 being half the space Sp, in the row direction and the column direction. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
