发明名称 HIGHLY ELECTROCONDUCTIVE PASTE COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide a highly electroconductive paste composition containing as a binder a glass composition which is free from lead, and contains no component that moves to a semiconductor or a glass substrate to change the resistance value thereof. SOLUTION: The highly electroconductive paste composition comprises: alkali metal-free bismuth-based electroconductive glass (A) as the binder; electroconductive metal powder and a metal-containing compound (B); a polymeric substance (C); and a solvent or liquid substance (D) which can dissolve or disperse the (C). COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011144077(A) 申请公布日期 2011.07.28
申请号 JP20100006414 申请日期 2010.01.15
申请人 TOKYO ELECTRONICS CHEMICALS CORP;TOKAI INDUSTRY CORP 发明人 NARITA KICHIHEI
分类号 C03C8/18;H01B1/22 主分类号 C03C8/18
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