发明名称 |
PACKAGING METHOD INVOLVING REARRANGEMENT OF DICE |
摘要 |
A packaging method is disclosed that comprises attaching a plurality of dice, each having a plurality of bonding pads disposed on an active surface, to an adhesive layer on a substrate. A polymer material is formed over at least a portion of both the substrate and the plurality of dice and a molding apparatus is used on the substrate to force the polymer material to substantially fill around the plurality of dice. The molding apparatus is removed to expose a surface of the polymer material and a plurality of cutting streets is formed on an exposed surface of the polymer material. The substrate is removed to expose the active surface of the plurality of dice.
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申请公布号 |
US2011183467(A1) |
申请公布日期 |
2011.07.28 |
申请号 |
US201113082160 |
申请日期 |
2011.04.07 |
申请人 |
CHEN YU-REN;SHEN GENG-SHIN;CHIU TZ-CHENG |
发明人 |
CHEN YU-REN;SHEN GENG-SHIN;CHIU TZ-CHENG |
分类号 |
H01L21/56 |
主分类号 |
H01L21/56 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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