| 摘要 |
PROBLEM TO BE SOLVED: To provide a package for integrated optical semiconductor module capable of reducing power consumption, while improving the manufacturing yield of the integrated optical semiconductor module. SOLUTION: In the package for accommodating an integrated optical semiconductor element which is constituted by optically coupling two or more optical semiconductor elements via an optical element, one or more light-transmitting windows 9 for packaging are provided in addition to a light-transmitting window 19 used for input or output or input-output of the signal light for packaging of the optical element. COPYRIGHT: (C)2011,JPO&INPIT |
