| 摘要 |
Disclosed is a solder powder adhering apparatus, which finely adheres a solder powder to an electronic circuit board. Also disclosed is a method for adhering the solder powder to the electronic circuit board. The apparatus for adhering the solder powder is provided with: a container, which contains the electronic circuit board and the solder powder; a substrate holding unit, which is provided in the container, and which holds the electronic circuit board such that the substrate surface faces substantially the vertical direction; a tilting mechanism, which has a tilted position where the container is tilted in the first direction as the initial position of the container, and tilts the container in the second direction, which is the direction opposite to the first direction, then, tilts the container again in the first direction; an eccentric motor, which vibrates the bottom portion of the container by rotating the rotating shaft, and which is provided at the center of the bottom portion; and a vibrating mechanism which is composed of a control means that sets the rotating shaft of the eccentric motor in the direction same as the tilting direction of the container. |
