METHOD FOR PROTECTING OPTICAL DEVICES DURING MANUFACTURE
摘要
This disclosure regards methods for protecting a die during shaping and polishing of optical devices. According to various embodiments, layers can be added and removed from a wafer to protect both sides of the wafer during various steps of a manufacturing process.
申请公布号
WO2011091400(A2)
申请公布日期
2011.07.28
申请号
WO2011US22350
申请日期
2011.01.25
申请人
ILLUMITEX, INC.;JOHNSON, RANDALL, E.;KO, KYUNCHUL;DUONG, DUNG, T.;WINBERG, PAUL, N.
发明人
JOHNSON, RANDALL, E.;KO, KYUNCHUL;DUONG, DUNG, T.;WINBERG, PAUL, N.