| 摘要 |
Curable epoxy resin composition, which is suitable for the production of electrical insulation systems for low, medium and high voltage applications, including at least an epoxy resin, a hardener, a mineral filler material, and optionally further additives, wherein (i) the epoxy resin component is a diglycidylether of bisphenol A (DGEBA); (ii) the hardener includes methyltetrahydrophthalic anhydride (MTHPA) and polypropylene glycol (PPG), wherein (iii) the average molecular weight of the polypropylene glycol (PPG) is within the range of about 300 to about 510 Dalton; and (iv) the molar ratio of methyltetrahydrophthalic anhydride (MTHPA) to polypropylene glycol (PPG) is within the range of about 9:1 to 19:1. A method of making the epoxy resin composition and electrical articles made therefrom are also provided. |
