| 摘要 |
Some of the embodiments of the present disclosure provide apparatuses, systems, and methods for stacking chips. A first chip may be mounted on a substrate, wherein an active surface of the first chip faces away from the substrate, and wherein the first chip includes a plurality of bump pads located on the active surface of the first chip, and a wire may bond a first bump pad of the plurality of bump pads to the substrate. An intermediate layer may be disposed on at least a portion of the active surface of the first chip, and a via within the intermediate layer may extend to a second bump pad of the plurality of bump pads. A second chip may be disposed on the intermediate layer, wherein an active surface of the second chip faces towards the substrate, and wherein the second chip includes a third bump pad (i) located on the active surface of the second chip and (ii) aligned with the via formed in the intermediate layer. A corresponding bump may be disposed on one or more of (i) the second bump pad located on the active surface of the first chip and (ii) the third bump pad located on the active surface of the second chip, and within the via, wherein the corresponding bump electrically connects the second bump pad with the third bump pad. Other embodiments are also described and claimed.
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