| 摘要 |
A memory device is provided, including a substrate, a conductive layer, a charge storage layer, a plurality of isolation structures, a plurality of first doped regions, and a plurality of second doped regions. The substrate has a plurality of trenches. The conductive layer is disposed on the substrate and fills the trenches. The charge storage layer is disposed between the substrate and the conductive layer. The isolation structures are disposed in the substrate between two adjacent trenches, respectively. The first doped regions are disposed in an upper portion of the substrate between each isolation structure and each trench, respectively. The second doped regions are disposed in the substrate under a bottom portion of the trenches, in which each isolation structure is disposed between two adjacent second doped regions.
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