| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device that is efficiently cooled when generating heat. SOLUTION: The semiconductor device includes a cooling function component including active regions 5, 6 formed on a surface of a semiconductor layer, an N-type gate 7N made of a semiconductor including an N-type impurity, a P-type gate 7P made of a semiconductor including a P-type impurity, first metal wiring 13 connected to the N-type gate 7N, P-type gate 7P and active regions 5, 6, second metal wiring 15 connected to the P-type gate 7P and N-type gate 7N, and a heat dissipation part 19 connected to the second metal wiring 15 for dissipating heat to the outside. COPYRIGHT: (C)2011,JPO&INPIT |
