发明名称 |
SUBSTRATE HEATING APPARATUS, SUBSTRATE HEATING METHOD AND SUBSTRATE PROCESSING SYSTEM |
摘要 |
A substrate heating apparatus includes a container configured to be maintained in a depressurized state; and a substrate mounting table having a plurality of substrate support pins on its upper surface. The substrate mounting table is configured to mount a substrate while providing a gap between the upper surface of the substrate mounting table and the substrate. The substrate heating apparatus further includes a heater configured to heat the substrate through the substrate mounting table; a pressure regulator configured to regulate a pressure in the container; a temperature controller configured to control an output of the heater so as to control a temperature of the substrate mounting table; and a pressure controller configured to control the pressure regulator so as to control the pressure in the container.
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申请公布号 |
US2011183279(A1) |
申请公布日期 |
2011.07.28 |
申请号 |
US201113014111 |
申请日期 |
2011.01.26 |
申请人 |
TOKYO ELECTRON LIMITED |
发明人 |
OKUBO TOMOYA;SUGIYAMA MASAKI |
分类号 |
F27D1/00 |
主分类号 |
F27D1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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