SEMICONDUCTOR PACKAGE WITH EMBEDDED DIE AND ITS METHODS OF FABRICATION
摘要
Embodiments of the present invention describe a semiconductor package having an embedded die. The semiconductor package comprises a coreless substrate that contains the embedded die. The semiconductor package provides die stacking or package stacking capabilities. Furthermore, embodiments of the present invention describe a method of fabricating the semiconductor package that minimizes assembly costs.
申请公布号
WO2011090570(A2)
申请公布日期
2011.07.28
申请号
WO2010US59237
申请日期
2010.12.07
申请人
INTEL CORPORATION;GUZEK, JOHN, STEPHEN;GONZALEZ, JAVIER, SOTO;WATTS, NICHOLAS, R.;NALLA, RAVI, K.
发明人
GUZEK, JOHN, STEPHEN;GONZALEZ, JAVIER, SOTO;WATTS, NICHOLAS, R.;NALLA, RAVI, K.