发明名称 HEAT PUMP
摘要 <p>The present invention relates to a heat pump comprising a refrigerating cycle unit and a booster module. The refrigerating cycle unit comprises: a compressor in which a refrigerant is compressed; a first heat exchanger in which the refrigerant compressed by the compressor is condensed; an expansion device in which the refrigerant condensed by the first heat exchanger expands; and a second heat exchanger in which the refrigerant expanded by the expansion device evaporates. The booster module is connected to the refrigerating cycle to separate a refrigerant vapor from the refrigerant flowing from the first heat exchanger to the expansion device, compress the separated refrigerant vapor, and enable the compressed refrigerant to flow between the compressor and the first heat exchanger, or to compress the refrigerant evaporated in the second heat exchanger and enable the compressed refrigerant to flow between the compressor and the first heat exchanger. The heat pump of the present invention is advantageous in that heating ability can be conveniently improved, and optimum performance can be achieved in accordance with a variety of load conditions which might not be handled by a compressor of a refrigerating cycle unit alone.</p>
申请公布号 WO2011062349(A4) 申请公布日期 2011.07.28
申请号 WO2010KR04791 申请日期 2010.07.21
申请人 LG ELECTRONICS INC.;CHIN, SIM WON;JANG, YONG HEE;KIM, BUM SUK;RYU, BYOUNG JIN 发明人 CHIN, SIM WON;JANG, YONG HEE;KIM, BUM SUK;RYU, BYOUNG JIN
分类号 F25B30/02;F25B41/06;F25B43/02;F25B49/02 主分类号 F25B30/02
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