发明名称 FILLED POLYMER COMPOSITION FOR ETCH CHAMBER COMPONENT
摘要 <p>A filled polymer composition having improved plasma resistance is disclosed. The composition includes a particle filler dispersed in a polymer matrix. The particle filler can be Nb2O5, YF3, AlN, SiC or Si3N4 and rare earth oxides. In an embodiment, the composition is utilized as a bonding adhesive for electrostatic chuck, bonding adhesive for shower head, bonding adhesive for liner, sealing material, O-ring, or plastic component.</p>
申请公布号 SG172056(A1) 申请公布日期 2011.07.28
申请号 SG20110042140 申请日期 2009.12.08
申请人 APPLIED MATERIALS, INC. 发明人 SUN, JENNIFER, Y.;DUAN, REN-GUAN;THACH, SENH;XU, LI
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