| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To solve the problems wherein heat in sintering of a conductive paste is transferred to a resin substrate, and a material having a low heat resistance temperature cannot be used for the resin substrate in a wiring board in which wiring using the conductive paste is formed on the resin substrate, further the resin substrate is warped and mechanical characteristics deteriorate because of long time heating in sintering, and sintering of the conductive paste is incomplete and a conduction resistance increases in wiring after sintering by sintering at low temperature to prevent warpage of the resin substrate and deterioration of mechanical characteristics. <P>SOLUTION: In the wiring board, a layer made of oxide ceramics is provided between the wiring and the resin substrate. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
