| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a continuous substrate for a light emitting diode fluorescent lamp at a low cost, by providing a method for continuously manufacturing a substrate for a light emitting diode fluorescent lamp which does not use a printed board by forming an insulating part by a resin insert molding technology on a metal frame manufactured by press working for a simplified manufacturing process, resulting in simpler assembly process with a smaller number of components than an assembly process using a printed board. <P>SOLUTION: A method for manufacturing a continuous substrate for a light emitting diode fluorescent lamp which uses no printed board employs following means: firstly, an insulating part is formed by a resin insert molding technology that uses a metal die at a metal frame manufactured by press working to continuously include a terminal contact part of a light emitting diode and a wiring pattern in which an electric circuit can be formed at cut points; and secondly an electric circuit is formed by cutting parts requiring no conduction of the metal frame after formation of the insulating part. <P>COPYRIGHT: (C)2011,JPO&INPIT |
