| 摘要 |
PROBLEM TO BE SOLVED: To provide a method and an apparatus for dividing a semiconductor wafer that can securely and speedily divide the semiconductor wafer and is effective even if a pellet size is small. SOLUTION: The present invention relates to the method for dividing the semiconductor wafer which is characterized by forming a brittle portion L extending along a line of division into pellets on the semiconductor wafer W, applying the semiconductor wafer W to a support member 1 having a sharp edge 12 formed at one end edge of a contact surface 11, pressing the semiconductor wafer W by a roller 3 at a position opposed to the edge 12, and cleaving the semiconductor wafer W in sequence at the part of the brittle portion while moving the semiconductor wafer W continuously in a feed direction relatively to the support member 1 and the roller 3. The apparatus for implementing the method is also provided. COPYRIGHT: (C)2011,JPO&INPIT |
