| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To enhance adhesive strength between a lid (LID: lid material) and a wiring board. <P>SOLUTION: A semiconductor apparatus includes: a wiring board; and a lid stuck on the wiring board. The lid includes inlet portions for injection. A resin is injected into the lid from the inlet portions. The lid and wiring board are fixed with the injected resin. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
