| 摘要 |
The present invention relates to a method and device to reduce random defects in the yield. Particles that accidentally drop off in the semiconductor manufacturing process are likely to cause opened circuits and short circuits of a local line in a circuit layout, and the method of the present invention to reduce the random defects in the yield is for correcting a line in the post- routing layout where there is probably an open circuit or short circuit. The critical area of each opened circuit and short circuit in the line to be corrected is multiplied respectively by the weight and are cumulated, while said cumulative value is changed with different adjustments through wire spreading and wire widening, for optimized correction of wire spreading and wire widening of these lines. |
