| 摘要 |
<p>Disclosed is a semiconductor element processing method which both reduces processing time and enables the removal of resin adhesives from a semiconductor element. An IC chip (4) processing method, which removes ACF (6) from an IC chip in order to re-use the IC chip, comprises: a step for immersing an IC chip, which has ACF adhered thereto, in hot concentrated sulphuric acid (11); a step for immersing the IC chip in room temperature concentrated sulphuric acid (21); a step for immersing the IC chip in room temperature dilute sulphuric acid (31); and a step for rinsing the IC chip in water.</p> |
