发明名称 |
METHOD OF FORMING SEMICONDUCTOR DIE |
摘要 |
<P>PROBLEM TO BE SOLVED: To solve the problem that it is absolutely necessary for semiconductor dies to have regular shapes of squares and rectangles before since a singulation line which axially extends is used. <P>SOLUTION: In one embodiment, semiconductor dies having non-rectangular shapes and dies having various different shapes are formed and singulated from a semiconductor wafer. <P>COPYRIGHT: (C)2011,JPO&INPIT |
申请公布号 |
JP2011146717(A) |
申请公布日期 |
2011.07.28 |
申请号 |
JP20110007522 |
申请日期 |
2011.01.18 |
申请人 |
SEMICONDUCTOR COMPONENTS INDUSTRIES LLC |
发明人 |
GRIVNA GORDON M;SEDDON MICHAEL J |
分类号 |
H01L21/301 |
主分类号 |
H01L21/301 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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