| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an epoxy resin molding material for sealing which has excellent reliability in flame retardancy, formability, reflow resistance, moisture resistance, high-temperature shelf characteristics, etc., and is suitably used for sealing a VLSI. <P>SOLUTION: The epoxy resin molding material for sealing is composed of (A) an epoxy resin expressed by formula (I), (B) a curing agent and (F) a hydrocarbon-, hydroxy- or alkoxy-terminated silicon-containing polymer having an epoxy equivalent of 500-4,000. In formula (I), R<SP>1</SP>and R<SP>2</SP>are selected from substituted or unsubstituted 1-12C hydrocarbon and alkoxy; n is an integer of 0-4; and m is an integer of 0-6. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
